Company Mission

IP Enginuity’s mission is to become every client’s most competent, responsive, cost-effective, and trusted expert technical resource and strategic partner. Kurt and his team’s broad professional and IP experience is key in developing solutions for IPE’s clients.
“IP Enginuity was founded by Kurt Humphrey to bring a new perspective to intellectual property-related engineering services. Kurt’s broad professional experience is key in developing solutions for IPE’s clients.”

Leadership

Kurt brings over 30 years of industrial engineering, technology assessment and patent evaluation experience to IPE. He has held key technical positions at Philips Research Laboratories (Eindhoven, NL), AT&T Technologies, United Technologies Microelectronics Center, Rockwell Semicondutor Systems (Conexant) and Delco (Delphi) Electronics. His areas of technical expertise include microelectronic devices and their fabrication, e.g. silicon and compound semiconductors, passives, MEMS, sensors, photonics, and displays, as well as high-tech chemicals, materials, and coatings.

Kurt is also an accomplished inventor and holds patents in the areas of oxygen sensors, MEMS and semiconductor process technology as a result of his innovative work with General Motors Corporation, United Technologies and Rockwell Science Center. In his most recent position as Director of Engineering Programs at TAEUS International, Kurt managed numerous patent evaluation and product investigation projects across a broad array of technologies for many Global 100 high-tech companies in the U.S., Europe, Japan and Korea. He holds B.S. and M.S. degrees in Ceramic Engineering from the University of Missouri.

Technical Expertise and Skill Sets

Components, Fabrication and Packaging

  • ICs and semiconductors e.g. CMOS, FinFET, SOI, DRAM/
    SRAM/Flash, MPUs, GPUs, DSPs, SoCs, smart power”
  • “Microelectronic packaging e.g. BGA, flip-chip, 2D/2.5D/3D
    stacked
  • “Photonics, optical and quantum devices, e.g. DFB/MQW
    lasers, ROADMs, EDFAs, quantum dots.”
    d. “Displays e.g. LCD, LED, OLED”
  •  Replace “Optical devices…” with “Wireless Telecommunications, e.g. 4G/5G transceivers, eNBs/gNBs,
    MIMO/beamforming antennas, Bluetooth, 802.11”
  •  “MEMS and sensors e.g. bulk/surface/HAR, DMD, pressure, accelerometers, gyros, switches, magnetic, chemical, bio-
    medical
  • Delete separate “Sensors” bullet
  • Under “Systems”
  • “Automotive and batteries e.g. optical, radar, LIDAR, Li-ion/
    pouch, GPS”
  • “Medical/biotech e.g. blood analyzers, spinal stimulators,
    glucose/pulse ox

Systems

  • Computers and peripherals e.g. PCs, tablets, servers,
    modems, APs/WAPs, STBs, gaming consoles
  • Wireless Telecommunications, e.g. 4G/5G transceivers, eNBs
    gNBs, MIMO/beam-forming antennas, Bluetooth, 802.11
  • Networks, data storage and content distribution e.g. routers, gateways, switches, NICs, HDD, SSD, Blu-ray, audio/video codecs
  • Software and firmware:, e.g. BIOS, OS, DBM, e-commerce, mobile,
    encryption
  • Data storage
  • Aerospace/automotive e.g. ADAS, start/stop technology,
    emissions, EV, high-rel/mil-standard systems

 

 

Chemicals and High-tech Materials

  • Metals/alloys
  • Ceramics
  • Glass
  • Pigments/dyes
  • Batteries/fuel cells
  • Films/coatings
  • Semiconductors, e.g. silicon, germanium, III-V, II-VI
  • Organics and Polymers